Copper plate

C46400 brass round plate is a high-performance copper alloy material!

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Copper plate

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Copper plate

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Product Description

Brand	Variety	Status	Specification (mm)			Main characteristics or performance parameters	Main direction of use	Executive standards
			Thickness	Width	Length
T2, T2 conductive TU1, TU2, TP1, TP2, C1100 C10200	hot rolled plate	R	4～8	600～2000	≤ 5000	When thickness = 4~14mm, Rm ≥ 195Mpa A11.3 ≥ 30%	Wide range of general use	GB/T2040-2008 C10200, C1100 Negotiation
			＞8～60	100～3000	≤ 6000
			＞60～150	200～3000	≤ 6000	Not for performance		Q/LT001-92
	cold rolled sheet	M, Y4, Y2, Y, T	0.3～0.5	≤ 600	≤ 2000	M state: Rm ≥ 205Mpa A11.3 ≥ 30%; Y4 state: Rm = 215 ~ 275Mpa A11.3 ≥ 25%; Y2 state: Rm = 245 ~ 345Mpa A11.3 ≥ 8%; Y state: Rm ≥ 295 ~ 380Mpa; T state: Rm ≥ 350Mpa		GB/T2040-2008 C10200, C1100 Negotiation
			＞0.5～3.0	≤ 1020	≤ 3000
			＞3.0～12	≤ 3000	≤ 6000
T2 Guide	copper conductive plate	R	20～50	100～650	≤ 8000	See standard for high conductivity, tensile force, hardness and bending performance	Smelting, electrochemical, electroplating and other industries to manufacture conductive bus	GB/T2529-2005
		M, Y8, Y2, Y	4～20	100～650	≤ 8000
T2	Special pure copper plate	M	0.3～0.5	350～610	1000～2000	Rm≥205mpa a11.3 ≥ 42%; See standard for cupping and grain size		GJB1139-91
			＞0.5～3.0	≤ 1020	450～3000
			＞3.0～10	≤ 1000	≤ 2000
T2A		Y	4.0～8.0	200～1000	400～2000	Rm = 295 ~ 355Mpa A11.3 ≥ 5%; see standard for grain size
TAg0.1	silver copper hot rolled plate	R	4～8	600～2000	1000～5000	When thickness = 4~14mm, Rm≥ 195Mpa, A11.3 ≥ 30%	Crystallizer, etc.	Q/LT002-92
			＞8～60	600～3000	1000～6000
			＞60～150	600～2500	1000～4000
TU1 TU2 C10200 LC1011	Oxygen-free copper plate	And 、 Y2 、 M	0.3～0.5	≤ 600	≤ 2000	M state: Rm 195 ~ 260Mpa A11.3 ≥ 40%; Y2 state: Rm 245 ~ 315Mpa A11.3 ≥ 15%; Y state: Rm≥ 275Mpa See the standard for conductivity and oxygen content.	Electronics Industry Sector	GB/T14594-2005 C10200, LC1011 Negotiation
			＞0.5～3.0	≤ 1020	≤ 3000
			＞3.0～10	≤ 3000	≤ 6000
TU2	For cooling wall Oxygen-free copper plate	R	75～150	600～1590	1400～3600	high conductivity	blast furnace steelmaking	Enterprise Standard
LC1100	electronic tough copper	Y 、 Y2 、 Y4 、 M	0.5～2.5	≤ 1000	≤ 2000	See standard	Electronic Materials	Enterprise Standard
T2	copper door plate	Y	0.5～2.5	600～1000	≤ 3000	Tensile strength ≥ 300MPa, no crack at 90 ° bending	Copper door	Enterprise Standard
Note: Non-standard range products can be negotiated.

Brand	Variety	Status	Specification (mm)			Main characteristics or performance parameters	Main direction of use	Executive standards
			Thickness	Width	Length
T2, T2 conductive TU1, TU2, TP1, TP2, C1100 C10200	hot rolled plate	R	4～8	600～2000	≤ 5000	When thickness = 4~14mm, Rm ≥ 195Mpa A11.3 ≥ 30%	Wide range of general use	GB/T2040-2008 C10200, C1100 Negotiation
			＞8～60	100～3000	≤ 6000
			＞60～150	200～3000	≤ 6000	Not for performance		Q/LT001-92
	cold rolled sheet	M, Y4, Y2, Y, T	0.3～0.5	≤ 600	≤ 2000	M state: Rm ≥ 205Mpa A11.3 ≥ 30%; Y4 state: Rm = 215 ~ 275Mpa A11.3 ≥ 25%; Y2 state: Rm = 245 ~ 345Mpa A11.3 ≥ 8%; Y state: Rm ≥ 295 ~ 380Mpa; T state: Rm ≥ 350Mpa		GB/T2040-2008 C10200, C1100 Negotiation
			＞0.5～3.0	≤ 1020	≤ 3000
			＞3.0～12	≤ 3000	≤ 6000
T2 Guide	copper conductive plate	R	20～50	100～650	≤ 8000	See standard for high conductivity, tensile force, hardness and bending performance	Smelting, electrochemical, electroplating and other industries to manufacture conductive bus	GB/T2529-2005
		M, Y8, Y2, Y	4～20	100～650	≤ 8000
T2	Special pure copper plate	M	0.3～0.5	350～610	1000～2000	Rm≥205mpa a11.3 ≥ 42%; See standard for cupping and grain size		GJB1139-91
			＞0.5～3.0	≤ 1020	450～3000
			＞3.0～10	≤ 1000	≤ 2000
T2A		Y	4.0～8.0	200～1000	400～2000	Rm = 295 ~ 355Mpa A11.3 ≥ 5%; see standard for grain size
TAg0.1	silver copper hot rolled plate	R	4～8	600～2000	1000～5000	When thickness = 4~14mm, Rm≥ 195Mpa, A11.3 ≥ 30%	Crystallizer, etc.	Q/LT002-92
			＞8～60	600～3000	1000～6000
			＞60～150	600～2500	1000～4000
TU1 TU2 C10200 LC1011	Oxygen-free copper plate	And 、 Y2 、 M	0.3～0.5	≤ 600	≤ 2000	M state: Rm 195 ~ 260Mpa A11.3 ≥ 40%; Y2 state: Rm 245 ~ 315Mpa A11.3 ≥ 15%; Y state: Rm≥ 275Mpa See the standard for conductivity and oxygen content.	Electronics Industry Sector	GB/T14594-2005 C10200, LC1011 Negotiation
			＞0.5～3.0	≤ 1020	≤ 3000
			＞3.0～10	≤ 3000	≤ 6000
TU2	For cooling wall Oxygen-free copper plate	R	75～150	600～1590	1400～3600	high conductivity	blast furnace steelmaking	Enterprise Standard
LC1100	electronic tough copper	Y 、 Y2 、 Y4 、 M	0.5～2.5	≤ 1000	≤ 2000	See standard	Electronic Materials	Enterprise Standard
T2	copper door plate	Y	0.5～2.5	600～1000	≤ 3000	Tensile strength ≥ 300MPa, no crack at 90 ° bending	Copper door	Enterprise Standard
Note: Non-standard range products can be negotiated.

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